Advanced Materials For Electronics Packaging

Become Expert In The Field Of “Advanced Electronics Material”

In this world of fast growing electronics technology & miniaturization process, thousands of new portable and light weight electronics products are launched in the market each day and in various fields of electronics such as – consumer electronics , medical electronics , communication electronics , defence electronics , industrial electronics and in aerospace electronics . Due to complex circuit design & miniaturization , excessive amount of heat dissipation is happening in electronics products which is reducing the life-span of the components/devices .Thus thermal management of all electronics products has become an important issue . In this role of thermal management, “electronics packaging” plays a very important part .

What you’ll learn

  • Need for electronics packaging.
  • Different ICs packaging configurations.
  • 3 Packaging variations.
  • Difference between various “FR” boards.
  • Various Substrate materials.
  • Materials used to form “Electronics Glass” & application of “Electronics Glass”.
  • Various Ceramic Substrate materials that are currently being used and its technical details.
  • Advanced “TIM” material : “GELVET”.
  • Various metal matrix composites (MMCS) : Al-Diamond / AlSi / ASiC / Cu-Diamond / Al-Graphite.
  • Role of Diamond.
  • Carbon nanotubes (CNT) & its types : SWCNT / MWCNT.
  • Applications of “CNTS”.
  • Advanced materials used to form “PCM” – Phase Change Materials.
  • Materials used for EMI (Electro-Magnetic Interference) shielding.

Course Content

  • INTRODUCTION/OVERVIEW –> 8 lectures • 11min.
  • PACKAGING CONFIGURATIONS –> 2 lectures • 5min.
  • ELECTRONICS SUBSTRATE MATERIALS & THEIR FUNCTIONS IN THERMAL MANAGEMENT –> 3 lectures • 10min.
  • YOUR “PCB” SUBSTRATE : A GUIDE TO MATERIALS –> 3 lectures • 5min.
  • ADVANCED MATERIAL FOR “TIM” –> 2 lectures • 4min.
  • METAL MATRIX COMPOSITES (MMCs) OF HIGH THERMAL CONDUCTIVITY –> 9 lectures • 14min.
  • PHASE CHANGE MATERIALS –> 1 lecture • 3min.
  • ELECTROMAGNETIC SHIELDING (EMI) –> 1 lecture • 1min.
  • COURSE CLOSING SESSION –> 2 lectures • 2min.

Advanced Materials For Electronics Packaging

Requirements

  • No prior skills required.

In this world of fast growing electronics technology & miniaturization process, thousands of new portable and light weight electronics products are launched in the market each day and in various fields of electronics such as – consumer electronics , medical electronics , communication electronics , defence electronics , industrial electronics and in aerospace electronics . Due to complex circuit design & miniaturization , excessive amount of heat dissipation is happening in electronics products which is reducing the life-span of the components/devices .Thus thermal management of all electronics products has become an important issue . In this role of thermal management, “electronics packaging” plays a very important part .

Here in this short course you will study in detail about the “advanced materials used in electronics packaging“.

What you will learn in this course ???????

What is electronics packaging

Why we need electronics packaging

6 Hierarchy in electronics packaging

3 Packaging variations

7 different types of packaging configurations & their applications

Different types of substrate materials

What is so great about FR4 board

Difference between FR1/2/3 & FR4 board properties

Materials used to form electronic glass substrate and application of electronic glass

In-depth knowledge on ceramic substrate materials

GELVET TIM technology

Metal matrix composite (MMCS) materials : Al-Si , Al-SiC ,Cu-Diamond , Al-Diamond , Gold-Gold Interconnections (GGI) & Al-Graphite composite

Technical details on Carbon Nano Tube (CNTS)

PCM materials

Electro-magnetic-interference (EMI) shielding materials

At the end of this course , a RESOURCE File is provided which will help you a lot in further understanding of the topics given in this course .

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